Contact Details:
Master Bond Inc
154 Hobart Street
Hackensack
NJ
07601
United States of America
Tel: +1 201 343-8983
Fax: +1 201 343-2132
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Competitive Potting Compound Working Life Exceeds Conventional Potting Epoxies
Product News Thursday, October 29, 2009: Master Bond Inc
Master Bond’s newly developed EP29LP 1epoxy is an attractive potting compound for use in large potting and encapsulating applications. Presenting a gamut of significant potting properties, good compound flow, easy set up and convenient handling, it exhibits a remarkably low exotherm, maximum pot life and desirable electrical insulation qualities . The very long working life at ambient temperatures exceeds 6 hours and qualifies this compound for filament winding applications. Its excellent physical strength properties enhance component resistance to thermal shock and it has excellent resistance to chemicals such as fuels, acids, bases, water and salts.
EP29LP-1 is a low viscosity, two part, optically clear epoxy designed to adhere to many substrates, including optical fibers and fibrous reinforcements such as glass, aramid, and graphite. The low viscosity speeds impregnation and facilitates air release. The availability of versatile cure schedules- ambient temperature or accelerated elevated temperature cures, further simplifies manufacturing applications.
The shear bond strength of EP29LP-1 is greater than 3,500 psi, assuring durable and long lasting performance. It has a peak exotherm as low as 50°C to help avoid excess heat buildup and damage to thermally sensitive components. Extended operating temperature ranges from 74°C to 120°C
About Master Bond’s Potting Compounds:
Master Bond is a forefront adhesives manufacturer offering an impressive line of potting and encapsulation materials designed to protect electronic circuitry and assemblies from potentially damaging conditions such as moisture, corrosive chemicals, excessive heat, vibration, mechanical impact and thermal shocks. Master Bond, as a polymer formulator, uses rigid and flexible epoxies, polyurethanes and silicone compounds. They feature outstanding electrical insulation characteristics including high volume resistivity, excellent dielectric strength and heat dissipation factors.
